Publication 1785-10.5 - November 1998
Appendix
A
Specifications
General This table lists general specifications.
Backplane Current
3.6A
Heat Dissipation
65.00 BTU/hr
Environmental Conditions
Operating Temperature. . . . . . . 0 to 60°
C (32-140° F)
Storage Temperature . . . . . . . . –40 to 85° C (–40 to 185° F)
Relative Humidity . . . . . . . . . . . 5 to 95% (without condensation)
Shock
Operating . . . . . .30 g peak acceleration for 11±1 ms duration
Non-operating . . . 50 g peak acceleration for 11±1 ms duration
Vibration
(operating and
non-operating)
1 g @ 10 to 500 Hz
0.012 inches peak-to-peak displacement
Time-of-Day
Clock/Calendar
1
Maximum Variations at 60° C. . ± 5 min per month
Typical Variations at 20° C. . . . ± 20 s per month
Timing Accuracy. . . . . . . . . . . . 1 program scan
Battery
1770-XYC
Memory Modules
1785-ME16 1785-ME64
1785-ME32 1785-M100
Typical Discrete I/O Scan
• 0.5 ms / extended-local I/O adapter
• 10 ms / remote I/O rack at 57.6 kbps
• 7 ms / remote I/O rack at 115.2 kbps
• 3 ms / remote I/O rack at 230.4 kbps
I/O Modules
Bulletin 1771 I/O including 8-, 16-, 32-pt, and intelligent
modules
Hardware Addressing
2-slot
• Any mix of 8-pt modules
• 16-pt modules must be I/O pairs
• No 32-pt modules
1-slot
• Any mix of 8- or 16-pt modules
• 32-pt modules must be I/O pairs
1/2-slot – Any mix of 8-,16-, or 32-pt modules
1
Please note that the Clock/Calendar will update appropriately each year, including the year 2000.
Comments to this Manuals