Rockwell Automation 1785 PLC-5 Specifications download pdf (Page 31)

I/O Module Choices 29

1785-SO036C-EN-P - April 2002

1792D ArmorBlock MaXum I/O

modules

The 1792D I/O modules (ArmorBlock MaXum I/O) are designed for

applications where I/O can be distributed without an enclosure.

The block I/O modules feature:

• a unique design that accommodates any DeviceNet media such as

standard, round or KwikLink

flat connection

• DeviceLogix Smart Component Technology provides limited I/O

logic for intelligent I/O block

• autobaud capability allows automatic match of system

• rotary node address switches for easy configuration

When you select 1792D ArmorBlock MaXum I/O modules, the I/O

circuits, a built-in power supply, and a DeviceNet I/O adapter are

included. You must select cabling components. These modules do not

require an enclosure.

For more information about 1792D ArmorBlock MaXum I/O, see the

1792D ArmorBlock MaXum I/O Technical Data, publication

1792-TD001.

1798 FLEX Armor I/O modules The 1798 series I/O modules (FLEX Armor) is a hardened, fully modular

and expandable I/O system. FLEX Armor is designed to be distributed

throughout your application and mounted directly on your machine or in

a Class I, Division 2 area. Additionally, the 1798 series I/O modules are

designed to endure harsh, shop-floor applications where grease, water

and particulate materials are present.

• small size, which reduces packaging costs

• zero cabinet - reduces wiring and installation time

• diagnostics and RIUP which lowers the mean time to repair

equipment and leverages your control investment

• quick-connect sealed connectors, flexible and modular construction,

robust status indicators reduce commissioning time

• rated NEMA 4X/6P, IP65/67, saves the cost of an enclosure

When you select 1798 FLEX Armor I/O modules, you must also select:

• adapter module and cabling components

• terminal base unit

• DIN rail

• power supply

For more information, see the FLEX Armor I/O Technical Data,

publication 1798-TD001.

I/O Module Choices

Features:

• sealed housing and connectors for

washdown in dirty environments

• compact size

• no enclosure required, rated NEMA

4X/6P and IP67

• extended vibration and temperature

specifications

• mount vertically or horizontally

Characteristic: Description:

Type of products available • digital

Communication • DeviceNet I/O

Features:

• modular IP67

platform

• can be built and optimized around

an application

• enclosureless platform

• 12mm or 18mm connections to

DeviceNet

Characteristic: Description:

Types of products available • digital and analog

Communications • Local I/O and DeviceNet I/O

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Rockwell Automation 1785 PLC-5 Specifications Page 31

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